this is information on a product in full production. september 2012 doc id 023272 rev 1 1/8 8 STPS8H100DEE high voltage power schottky rectifier datasheet ? production data features very low conduction losses negligible switching losses extremely fast switching low thermal resistance avalanche capacity specified high junction temperature ecopack ? 2 compliant component description this schottky rectifier is designed for switch mode power supply and high frequency dc to dc converters. packaged in powerflat?, this device is intended for use in low voltage, high frequency, inverters, free-wheeling, by-pass diode and polarity protection applications.its low profile was especially designed to be used in applications with space-saving constraints. tm: powerflat is a trademark of stmicroelectronics table 1. device summary symbol value i f(av) 8 a v rrm 100 v t j (max) 175 c v f (typ) 0.68 v a a k a nc a a nc nc a a a a k k powerflat (3.3 x 3.3) STPS8H100DEE-tr www.st.com
characteristics STPS8H100DEE 2/8 doc id 023272 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.61 x i f(av) + 0.0088 x i f 2 (rms) table 2. absolute ratings (limiting values t amb = 25 c unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) forward rms current 15 a i f(av) average forward current tc = 150 c ?? = 0.5 8 a i fsm surge non repetitive forward current tp = 10 ms sinusoidal 100 a p arm (1) 1. for pulse time duration deratings, please refer to figure 3 . more details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the stmicr oelectronics application notes an1768, ?admissible avalanc he power of schottky diodes? and an2025, ?converter improvement using schottky rectifier avalanche specification?. repetitive peak avalanche power t p = 10 s t j = 125 c 480 w t stg storage temperature range -65 to +175 c tj maximum operating junction temperature 175 c table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 4 c/w table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, ? < 2% reverse leakage current t j = 25 c v r = v rrm -4.5a t j = 125 c - 2 6 ma v f (2) 2. pulse test: t p = 380 s, ? < 2% forward voltage drop t j = 25 c i f = 8a 0.82 v t j = 125 c - 0.60 0.68 t j = 25 c i f = 10a 0.85 t j = 125 c - 0.62 0.70 t j = 25 c i f = 16a 0.90 t j = 125 c - 0.68 0.75
STPS8H100DEE characteristics doc id 023272 rev 1 3/8 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature( ? = 0.5) p f(av) (w) 0 1 2 3 4 5 6 7 012345678910 t =tp/t tp i f(av) (a) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 2 4 6 8 10 0 25 50 75 100 125 150 175 i f(av) (a) t amb (c) t =tp/t tp r th(j-a) =r th(j-c) figure 3. normalized avalanche power derating versus pulse duration figure 4. relative variation of thermal impedance junction to case versus pulse duration p(t p ) p (10 s) arm arm 0.001 0.01 0.1 1 1 10 100 1000 t (s) p z th(j-c) /r th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse figure 5. reverse leakage current versus reverse voltage applied (typical values) figure 6. junction capacitance versus reverse voltage applied (typical values) i r (ma) 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 102030405060708090100 v r (v) t j = 150 c t j = 125 c t j = 100 c t j = 75 c t j = 50 c t j = 25 c c(pf) 10 100 1000 1 10 100 v r (v) f=1 mhz v osc =30 mv rms t j = 25c
characteristics STPS8H100DEE 4/8 doc id 023272 rev 1 figure 7. forward voltage drop versus forward current figure 8. thermal resistance junction to ambient versus copper surface under tab i fm (a) 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 v fm (v) t j =25 c (maximum values) t j =125 c (maximum values) t j =125 c (typical values) r th(j-a) (c/w) 0 50 100 150 200 250 012345678910 powerflat (3.3x3.3) s cu (cm2) epoxy printed board fr4, copper thickness =35m
STPS8H100DEE package information doc id 023272 rev 1 5/8 2 package information epoxy meets ul94,v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. powerflat-3.3x3.3-8l dimensions (definitions) table 5. powerflat-8l dimensions (values) ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.95 1.00 1.05 0.037 0.039 0.041 a3 0.20 0.0079 a4 0.20 0.0079 b 0.30 0.37 0.44 0.012 0.015 0.017 d 3.20 3.30 3.40 0.126 0.130 0.134 d2 2.24 2.31 2.38 0.088 0.091 0.094 d3 1.60 1.67 1.74 0.063 0.066 0.069 e 0.65 0.026 e 3.20 3.30 3.40 0.126 0.130 0.134 e2 1.68 1.75 1.82 0.066 0.069 0.072 l 0.31 0.38 0.45 0.012 0.015 0.018 l1 0.55 0.62 0.69 0.22 0.024 0.027 l2 0.86 0.93 1.00 0.034 0.037 0.039 a4 d2 l e2 l1 b e e/2 d3 l2 a a3 e e/2 d d/2 a nc k k a nc projection exposed pad index area (d/2 x e/2)
package information STPS8H100DEE 6/8 doc id 023272 rev 1 figure 10. footprint (dimensions in mm) 3.50 1.75 1.75 1.79 0.52 0.21 1.25 0.42 0.80 2.28 3.50
STPS8H100DEE ordering information doc id 023272 rev 1 7/8 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode STPS8H100DEE-tr s8h100 powerflat (3.3 x 3.3) 34 mg 3000 tape and reel 13? reel table 7. document revision history date revision changes 09-sep-2012 1 first issue.
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